The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 07, 2017
Filed:
Mar. 12, 2013
Applicant:
Henkel Ag & Co. Kgaa, Duesseldorf, DE;
Inventors:
Assignee:
HENKEL AG & CO. KGAA, Duesseldorf, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 1/02 (2006.01); B32B 5/16 (2006.01); C09J 9/02 (2006.01); C09J 11/04 (2006.01); C09J 163/00 (2006.01); C08K 3/08 (2006.01); C08K 7/00 (2006.01); H01R 4/04 (2006.01);
U.S. Cl.
CPC ...
H01B 1/02 (2013.01); B32B 5/16 (2013.01); C09J 9/02 (2013.01); C09J 11/04 (2013.01); C09J 163/00 (2013.01); C08K 3/08 (2013.01); C08K 7/00 (2013.01); H01R 4/04 (2013.01); Y10T 428/25 (2015.01);
Abstract
The present invention relates to adhesives that are suitable for use as electrically conductive materials in the fabrication of electronic devices, integrated circuits, semiconductor devices, passive components, solar cells, solar modules, and/or light emitting diodes. The adhesives comprise at least one resin component, micron-sized electrically conductive particles having an average particle size of 2 μm to 50 μm, and from 0.01 to 15 wt. % of sub-micron-sized electrically conductive particles having a average particle size of 300 nm to 900 nm.