The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 07, 2017

Filed:

Feb. 26, 2015
Applicant:

Cypress Semiconductor Corporation, San Jose, CA (US);

Inventors:

Rajagopal Narayanasamy, Bangalore, IN;

Mahadevan Krishnamurthy Narayana Swamy, Mysore, IN;

David G. Wright, Woodinville, WA (US);

Steve Kolokowsky, San Diego, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 27/26 (2006.01); G06F 3/041 (2006.01); G06F 3/045 (2006.01); G06F 3/044 (2006.01); H03K 17/96 (2006.01); G01D 5/24 (2006.01); G06F 3/01 (2006.01); H03K 17/60 (2006.01);
U.S. Cl.
CPC ...
G06F 3/044 (2013.01); G01D 5/2405 (2013.01); G06F 3/016 (2013.01); H03K 17/962 (2013.01); G06F 2203/04101 (2013.01); G06F 2203/04106 (2013.01); H03K 17/602 (2013.01); H03K 2017/9602 (2013.01); H03K 2217/960715 (2013.01); H03K 2217/960725 (2013.01); H03K 2217/960755 (2013.01);
Abstract

A method and apparatus include a plurality of sensor elements arranged within an integrated circuit package and a controller arranged within the integrated circuit package and coupled to the plurality of sensor elements. The controller is configured to apply a transmit signal to a first sensor element of the plurality of sensor elements and receive a receive signal from a second sensor element of the plurality of sensor elements. The receive signal represents a mutual capacitance of the first sensor element and the second sensor element.


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