The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 07, 2017

Filed:

Dec. 15, 2014
Applicants:

Henkel Ip & Holding Gmbh, Duesseldorf, DE;

Henkel Ag & Co. Kgaa, Duesseldorf, DE;

Inventors:

John G. Woods, Farmington, CT (US);

Peter D. Palasz, Maidenhead, GB;

Andrew Slark, Wokingham, GB;

Guillaume Chauveau, Digoin, FR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08F 2/46 (2006.01); B29C 71/04 (2006.01); C08G 61/04 (2006.01); C08F 265/06 (2006.01); C08F 120/14 (2006.01); C08F 293/00 (2006.01);
U.S. Cl.
CPC ...
C08F 265/06 (2013.01); C08F 120/14 (2013.01); C08F 293/005 (2013.01); C08F 2438/00 (2013.01); C08F 2438/01 (2013.01);
Abstract

Disclosed is a method for formation of block copolymers using a Single Electron Transfer Living Radical Polymerization (SET-LRP) process. The process can be used to form di and tri-block copolymers from vinyl monomers. In one embodiment the SET-LRP process comprises initially forming a macroinitiator using SET-LRP to form a first block of a di or tri-block copolymer and then using SET-LRP to form additional blocks of the copolymer. The produced block copolymers have very narrow polydispersity indexes and controlled molecular weights. The process permits incorporation of photoinitiators in any of the block formation reactions. The method also includes purification processes that result in a block copolymer having very low color making it useful in a variety of applications. In one application block copolymers prepared according to the present process can be used in hot-melt adhesives.


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