The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 07, 2017

Filed:

Aug. 01, 2011
Applicants:

Gerda Fuhrmann, Stuttgart, DE;

Gabriele Nelles, Stuttgart, DE;

Silvia Rosselli, Stuttgart, DE;

Nikolaus Knorr, Stuttgart, DE;

Alfred Paris, Salzburg, AT;

Maria Kaufmann, Anif, AT;

Georg Bauer, Salzburg, AT;

Inventors:

Gerda Fuhrmann, Stuttgart, DE;

Gabriele Nelles, Stuttgart, DE;

Silvia Rosselli, Stuttgart, DE;

Nikolaus Knorr, Stuttgart, DE;

Alfred Paris, Salzburg, AT;

Maria Kaufmann, Anif, AT;

Georg Bauer, Salzburg, AT;

Assignees:

Sony Corporation, Tokyo, JP;

Sony DADC Austria AG, Anif, AT;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B81B 1/00 (2006.01); B01L 3/00 (2006.01); B81C 3/00 (2006.01); C08J 7/04 (2006.01); C08J 7/06 (2006.01); C08J 7/12 (2006.01); B32B 3/02 (2006.01); B32B 37/14 (2006.01); B05D 1/00 (2006.01); C23C 16/04 (2006.01); B81C 1/00 (2006.01); C08L 83/04 (2006.01);
U.S. Cl.
CPC ...
B81B 1/00 (2013.01); C08J 7/04 (2013.01); C08J 7/047 (2013.01); C08J 7/06 (2013.01); C08J 7/123 (2013.01); B01L 3/502707 (2013.01); B01L 2300/16 (2013.01); B01L 2300/161 (2013.01); B05D 1/62 (2013.01); B81C 1/00206 (2013.01); B81C 3/00 (2013.01); B81C 2201/0197 (2013.01); C08J 2383/04 (2013.01); C08L 83/04 (2013.01); C23C 16/045 (2013.01); Y02P 20/582 (2015.11); Y10T 156/10 (2015.01);
Abstract

The present invention relates to a polymeric substrate having a glass-like surface, in particular an etched-glass-like surface and to a chip made of at least one such polymeric substrate. The present invention also relates to a method of providing a polymeric substrate with an etched-glass-like surface. Moreover, the present invention relates to a kit for manufacturing a chip using such polymeric substrate. Moreover, the present invention relates to the use of a polymeric substrate having a glass-like surface, in particular an etched-glass-like surface for manufacturing a chip.


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