The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 07, 2017
Filed:
Jan. 19, 2012
Applicants:
Wei-hsing Tuan, Taipei, TW;
Shao-kuan Lee, Taipei, TW;
Inventors:
Wei-Hsing Tuan, Taipei, TW;
Shao-Kuan Lee, Taipei, TW;
Assignee:
NATIONAL TAIWAN UNIVERSITY, Taipei, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/20 (2006.01); H01L 23/373 (2006.01); H05K 3/38 (2006.01); B32B 18/00 (2006.01); C04B 37/02 (2006.01); H05K 1/03 (2006.01); H05K 3/18 (2006.01);
U.S. Cl.
CPC ...
B32B 15/20 (2013.01); B32B 18/00 (2013.01); C04B 37/026 (2013.01); H01L 23/3735 (2013.01); H05K 3/388 (2013.01); B32B 2311/00 (2013.01); B32B 2315/02 (2013.01); B32B 2457/00 (2013.01); C04B 2235/6584 (2013.01); C04B 2235/9607 (2013.01); C04B 2237/062 (2013.01); C04B 2237/12 (2013.01); C04B 2237/122 (2013.01); C04B 2237/123 (2013.01); C04B 2237/125 (2013.01); C04B 2237/34 (2013.01); C04B 2237/341 (2013.01); C04B 2237/343 (2013.01); C04B 2237/366 (2013.01); C04B 2237/368 (2013.01); C04B 2237/407 (2013.01); C04B 2237/54 (2013.01); C04B 2237/56 (2013.01); C04B 2237/58 (2013.01); C04B 2237/597 (2013.01); C04B 2237/60 (2013.01); C04B 2237/704 (2013.01); C04B 2237/706 (2013.01); C04B 2237/708 (2013.01); C04B 2237/72 (2013.01); H01L 2224/48091 (2013.01); H01L 2924/09701 (2013.01); H05K 1/0306 (2013.01); H05K 3/181 (2013.01); H05K 2201/0355 (2013.01); H05K 2201/068 (2013.01); H05K 2203/072 (2013.01); Y10T 428/12479 (2015.01); Y10T 428/249984 (2015.04);
Abstract
A ceramic/metal composite structure includes an aluminum oxide substrate, an interface bonding layer and a copper sheet. The interface bonding layer is disposed on the aluminum oxide substrate. The copper sheet is disposed on the interface bonding layer. The interface bonding layer bonds the aluminum oxide substrate to the copper sheet. Some pores are formed near or in the interface bonding layer. A porosity of the interface bonding layer is substantially smaller than or equal to 25%.