The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 07, 2017

Filed:

Oct. 03, 2014
Applicant:

Zephyros, Inc., Romeo, MI (US);

Inventors:

Patrick Siboni, Les Granges, FR;

John Blancaneaux, Fegersheim, FR;

Assignee:

ZEPHYROS, INC., Romeo, MI (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
A41H 37/00 (2006.01); A44B 19/00 (2006.01); B29C 65/00 (2006.01); B32B 37/00 (2006.01); C09J 163/00 (2006.01); B32B 3/12 (2006.01); B29C 65/48 (2006.01); C09J 5/06 (2006.01); E04C 2/36 (2006.01); F16B 5/01 (2006.01); B32B 7/00 (2006.01); B32B 7/02 (2006.01); B32B 7/12 (2006.01); B32B 27/38 (2006.01); F16B 37/04 (2006.01); B29C 65/54 (2006.01); B32B 37/14 (2006.01); B29K 63/00 (2006.01); F16B 11/00 (2006.01);
U.S. Cl.
CPC ...
B29C 65/4815 (2013.01); B32B 3/12 (2013.01); B32B 7/00 (2013.01); B32B 7/02 (2013.01); B32B 7/12 (2013.01); B32B 27/38 (2013.01); C09J 5/06 (2013.01); E04C 2/365 (2013.01); F16B 5/01 (2013.01); F16B 37/048 (2013.01); B29C 65/542 (2013.01); B29C 66/474 (2013.01); B29C 66/72525 (2013.01); B29K 2063/00 (2013.01); B32B 37/146 (2013.01); B32B 2250/40 (2013.01); B32B 2605/00 (2013.01); B32B 2605/18 (2013.01); C09J 2463/00 (2013.01); F16B 11/006 (2013.01);
Abstract

The present invention contemplates a method for the attachment of a component to a honeycomb structure comprising forming a cavity in the honeycomb structure whereby the cavity is formed within one or more honeycomb cells; placing an insert adapted to enable the attachment of the component to the honeycomb structure whereby a reformable epoxy resin adhesive is injected about the insert or an expandable reformable epoxy resin adhesive is overmolded onto the insert; heating the reformable epoxy resin adhesive; and hardening and adhering the reformable epoxy resin adhesive to one or more interior walls of the cavity upon cooling.


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