The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 07, 2017

Filed:

Jul. 09, 2014
Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventors:

Satoshi Abe, Osaka, JP;

Masataka Takenami, Osaka, JP;

Isamu Matsumoto, Osaka, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 26/16 (2006.01); B23K 26/00 (2014.01); B22F 3/24 (2006.01); B29C 67/04 (2006.01); C04B 35/64 (2006.01); B28B 1/00 (2006.01); B29C 67/00 (2006.01); B33Y 40/00 (2015.01); B22F 3/105 (2006.01); B22F 3/16 (2006.01); C04B 35/622 (2006.01); B29L 31/00 (2006.01);
U.S. Cl.
CPC ...
B23K 26/0093 (2013.01); B22F 3/1055 (2013.01); B22F 3/162 (2013.01); B22F 3/24 (2013.01); B23K 26/16 (2013.01); B28B 1/001 (2013.01); B29C 67/0077 (2013.01); B29C 67/0085 (2013.01); B29C 67/04 (2013.01); B33Y 40/00 (2014.12); C04B 35/622 (2013.01); C04B 35/64 (2013.01); B22F 2003/1056 (2013.01); B22F 2003/247 (2013.01); B22F 2998/10 (2013.01); B29L 2031/772 (2013.01); C04B 2235/6026 (2013.01); C04B 2235/612 (2013.01); C04B 2235/665 (2013.01); Y02P 10/295 (2015.11);
Abstract

There is provided a selective laser sintering method capable of reducing the trouble in chipping or breakage of the machining tool and the like. The manufacturing method according to an embodiment of the present invention is a method for manufacturing a three-dimensional shaped object by repetition of a powder-layer forming and a solidified-layer forming, the repetition including the steps of (i) forming a solidified layer by irradiating a predetermined portion of a powder layer with a light beam, thereby allowing a sintering of the powder in the predetermined portion or a melting and subsequent solidification thereof, and (ii) forming another solidified layer by newly forming a powder layer on the resulting solidified layer, followed by the irradiation of a predetermined portion of the powder layer with the light beam.


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