The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 28, 2017
Filed:
Oct. 02, 2013
Tdk Corporation, Tokyo, JP;
Tanaka Kikinzoku Kogyo K.k., Tokyo, JP;
Minoru Sato, Tokyo, JP;
Tomoaki Kawata, Tokyo, JP;
Masahiro Hirano, Hiratsuka, JP;
Shigekazu Onozumi, Hiratsuka, JP;
TDK Corporation, Tokyo, JP;
Tanaka Kikinzoku Kogyo K.K., Tokyo, JP;
Abstract
[Problem to be solved] The present invention provides a conductive paste for constrained firing and a ceramic substrate manufactured with the conductive paste, the conductive paste having an excellent plating resistance and a good adherence against a ceramic substrate and a plated film even after plating treatment, wherein a constraining layer after firing can be easily removed without remaining on a surface conductor in a case where co-firing is performed. [Solution] Provided is a conductive paste comprising 60 to 95 mass % of an Ag powder as the content in a paste composition, 0.5 to 5 mass % of a borosilicate based glass powder relative to the Ag powder, the remainder being a platinum group metal additive and an organic vehicle, wherein the platinum group metal additive contains at least two metals of Ru and Rh, and the content of Ru and the content of Rh in the platinum group metal additive are 0.05 to 5 mass % of Ru and 0.001 to 0.1 mass % of Rh respectively in terms of metal components relative to the mass of the Ag powder