The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 28, 2017

Filed:

Jan. 05, 2016
Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventors:

Hiroharu Inoue, Osaka, JP;

Shingo Yoshioka, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/08 (2006.01); B32B 15/09 (2006.01); B32B 15/092 (2006.01); B32B 15/098 (2006.01); B32B 27/04 (2006.01); C09J 163/00 (2006.01); H05K 1/03 (2006.01); C08L 63/00 (2006.01); C08J 5/24 (2006.01); C08L 79/08 (2006.01); C09D 163/00 (2006.01); C09D 179/08 (2006.01); C08G 59/24 (2006.01); C08G 59/62 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0373 (2013.01); C08G 59/245 (2013.01); C08J 5/24 (2013.01); C08L 63/00 (2013.01); C08L 79/08 (2013.01); C09D 163/00 (2013.01); C09D 179/08 (2013.01); H05K 1/0353 (2013.01); B32B 2311/00 (2013.01); B32B 2457/08 (2013.01); C08G 59/621 (2013.01); C08J 2363/00 (2013.01); C08J 2379/08 (2013.01); C08J 2433/00 (2013.01); C08L 2203/20 (2013.01); C08L 2205/03 (2013.01); H05K 1/0346 (2013.01); H05K 1/0366 (2013.01); H05K 2201/0162 (2013.01); H05K 2201/09136 (2013.01); Y10T 156/10 (2015.01); Y10T 428/31529 (2015.04);
Abstract

A resin composition that becomes a cured product that exhibits force response behavior such that an area surrounded by a tensile stress-strain curve f1(x), when an amount of strain is increased from 0% to 0.3% by pulling at 999 μm/min while plotting the amount of strain on the x axis and tensile stress on the y axis, and also surrounded by the x axis, is greater than an area surrounded by a stress-strain curve f2(x), when the amount of strain is decreased from 0.3%, and also surrounded by the x axis, and the amount of change in the amount of strain when tensile stress is 0, before and after applying tensile stress, is 0.05% or less.


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