The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 28, 2017
Filed:
Oct. 28, 2013
Fujikura Ltd., Tokyo, JP;
Yasuyuki Tachikawa, Sakura, JP;
FUJIKURA LTD., Tokyo, JP;
Abstract
Provided is a printed circuit board which is used in a bent state, including: a substrate; a first conductive layer which is formed on the substrate; a first insulation layer which is formed on the substrate so as to cover the first conductive layer; and a second conductive layer which is formed on the first insulation layer, wherein on the assumption that the Youngs modulus of the first insulation layer is indicated by Ei1 and the fracture elongation of the second conductive layer is indicated by Bc2, the following equations (I) and (II) are satisfied.10 MPa<1<500 MPa  (I)2≧10%  (II)
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile