The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 28, 2017

Filed:

Jul. 10, 2015
Applicant:

Cooler Master Technology Inc., New Taipei, TW;

Inventor:

Shih-Hsiung Hsiao, New Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 1/10 (2006.01); H04R 1/28 (2006.01); H04R 1/26 (2006.01); H04R 1/02 (2006.01); H04H 40/45 (2008.01);
U.S. Cl.
CPC ...
H04R 1/2807 (2013.01); H04H 40/45 (2013.01); H04R 1/028 (2013.01); H04R 1/1091 (2013.01); H04R 1/26 (2013.01); H04R 1/2803 (2013.01); H04R 2499/11 (2013.01);
Abstract

A customization earphone structure and a detachable audio broadcasting module thereof are disclosed in the instant disclosure. The detachable audio broadcasting module includes an amplifier assembly and a detachable sound guiding assembly. The amplifier assembly includes a first outer casing and a plurality of first retaining structures disposed on the first outer casing. The first outer casing has an assembly concave groove. The detachable sound guiding assembly includes a second outer casing corresponding to the assembly concave groove, a sound-guiding component fixed and enclosed inside the second outer casing, and a plurality of second retaining structures disposed on the second outer casing. The detachable sound guiding assembly is received inside the assembly concave groove, the second outer casing is detachably positioned inside the assembly concave groove by respectively matching the second retaining structures and the first retaining structures with each other.


Find Patent Forward Citations

Loading…