The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 28, 2017

Filed:

Aug. 12, 2014
Applicant:

Skyworks Solutions, Inc., Woburn, MA (US);

Inventors:

Alan William Ake, Greensboro, NC (US);

David C. Dening, Stokesdale, NC (US);

Assignee:

SKYWORKS SOLUTIONS, INC., Woburn, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03G 3/30 (2006.01); H03F 3/195 (2006.01); H01L 23/66 (2006.01); H01L 23/00 (2006.01); H03F 1/32 (2006.01); H03F 3/191 (2006.01); H03F 3/193 (2006.01); H03F 3/21 (2006.01); H03F 3/24 (2006.01); H03F 3/343 (2006.01); H03F 1/30 (2006.01);
U.S. Cl.
CPC ...
H03F 3/195 (2013.01); H01L 23/66 (2013.01); H01L 24/06 (2013.01); H03F 1/32 (2013.01); H03F 1/3205 (2013.01); H03F 3/191 (2013.01); H03F 3/193 (2013.01); H03F 3/211 (2013.01); H03F 3/245 (2013.01); H03F 3/3435 (2013.01); H01L 2223/665 (2013.01); H01L 2223/6611 (2013.01); H01L 2223/6616 (2013.01); H01L 2223/6644 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48257 (2013.01); H01L 2224/49113 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/1306 (2013.01); H01L 2924/13062 (2013.01); H01L 2924/13063 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/3011 (2013.01); H01L 2924/30107 (2013.01); H03F 1/302 (2013.01); H03F 2200/451 (2013.01); H03F 2200/492 (2013.01); H03F 2200/93 (2013.01); H03G 3/30 (2013.01);
Abstract

Apparatus and methods for radio frequency (RF) amplifiers are disclosed herein. In certain implementations, a packaged RF amplifier includes a first bipolar transistor including a base electrically connected to an RF input pin and a collector electrically connected to an RF output pin, and a second bipolar transistor including a base electrically connected to an emitter of the first bipolar transistor and a collector electrically connected to the RF output pin. The packaged RF amplifier further includes a first bias circuit electrically connected between the base of the first bipolar transistor and the RF output pin, a second bias circuit electrically connected between the base of the first bipolar transistor and a power low pin, an inductor implemented at least partly by a bond wire, and a third bias circuit electrically connected in series with the inductor between the base of the second bipolar transistor and the power low pin.


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