The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 28, 2017

Filed:

Dec. 20, 2012
Applicant:

Fraunhofer-gesellschaft Zur Forderung Der Angewandten Forschung E.v., Munich, DE;

Inventors:

Axel Hulsmann, Freiburg, DE;

Harald Von Rosenberg, Konigsfeld, DE;

Karl-Friedrich Becker, Berlin, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01Q 19/06 (2006.01); H01Q 1/52 (2006.01); G01S 7/03 (2006.01); H01Q 21/00 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/526 (2013.01); G01S 7/03 (2013.01); H01Q 19/062 (2013.01); H01Q 21/00 (2013.01); H05K 1/0218 (2013.01); H05K 1/0243 (2013.01); H05K 1/036 (2013.01); H05K 3/4626 (2013.01); H05K 2201/0141 (2013.01); H05K 2201/10098 (2013.01);
Abstract

A millimeter-wave radar device including at least one millimeter-wave circuit and at least one antenna, wherein the millimeter-wave radar device is designed as a module having a multilayered multipolymer circuit board having at least a first layer composed of a polymer material having low dispersion of the dielectric constant, a second layer composed of a high-strength polymer material, which stabilizes the multipolymer circuit board, and a metallization layer, which is arranged between the first layer and the second layer and serves for shielding and for signal carrying, and the multipolymer circuit board carries the at least one millimeter-wave circuit and the at least one antenna.


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