The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 28, 2017

Filed:

May. 15, 2012
Applicants:

Taras Kushta, Tokyo, JP;

Takashi Harada, Tokyo, JP;

Inventors:

Taras Kushta, Tokyo, JP;

Takashi Harada, Tokyo, JP;

Assignee:

LENOVO INNOVATIONS LIMITED (HONG KONG), Quarry Bay, Hong Kong, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01P 1/203 (2006.01); H01P 7/08 (2006.01); H01P 1/208 (2006.01); H05K 1/16 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H01P 1/203 (2013.01); H01P 1/2088 (2013.01); H01P 1/20345 (2013.01); H01P 7/082 (2013.01); H05K 1/16 (2013.01); H05K 1/0222 (2013.01); H05K 1/0298 (2013.01);
Abstract

A filter of the present invention comprises a multilayer substrate, two terminals, a ground conductor and a hybrid resonator. The multilayer substrate includes a plurality of conductor layers and a dielectric configured to isolate said plurality of conductor layers from each other. The hybrid resonator is disposed in the multilayer substrate and comprises a first and a second resonant elements and a coupling strip connecting the first and said second resonant elements. Each resonant element comprises a signal via, a group of ground vias and an artificial dielectric. Each signal via is disposed through the multilayer substrate. Each group of ground vias is disposed through the multilayer substrate and configured to surround the signal via. Each artificial dielectric is disposed in the multilayer substrate and between the signal via and the group of ground vias. The artificial dielectric comprises a conductive plate connected to the first signal via and an isolating slit isolating the first conductive plate from the group of ground vias.


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