The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 28, 2017

Filed:

Sep. 01, 2011
Applicants:

David Christoph Mueller, Frankfurt am Main, DE;

Pawel Miskiewicz, Cambridge, MA (US);

Toby Cull, Newbury, GB;

Piotr Wierzchowiec, Southampton, GB;

Andrew Bell, Lakewood, OH (US);

Edmund Elce, Lakewood, OH (US);

Larry F. Rhodes, Silver Lake, OH (US);

Kazuyoshi Fujita, Tokyo, JP;

Hendra NG, Highland Heights, OH (US);

Pramod Kandanarachchi, Brecksville, OH (US);

Steven Smith, Perrysburg, OH (US);

Inventors:

David Christoph Mueller, Frankfurt am Main, DE;

Pawel Miskiewicz, Cambridge, MA (US);

Toby Cull, Newbury, GB;

Piotr Wierzchowiec, Southampton, GB;

Andrew Bell, Lakewood, OH (US);

Edmund Elce, Lakewood, OH (US);

Larry F. Rhodes, Silver Lake, OH (US);

Kazuyoshi Fujita, Tokyo, JP;

Hendra Ng, Highland Heights, OH (US);

Pramod Kandanarachchi, Brecksville, OH (US);

Steven Smith, Perrysburg, OH (US);

Assignees:

Merck Patent GmbH, , DE;

Promerus LLC, Brecksville, OH (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 27/32 (2006.01); C08F 132/08 (2006.01); H01L 51/00 (2006.01); C08L 65/00 (2006.01); C08F 232/00 (2006.01); H01L 51/05 (2006.01);
U.S. Cl.
CPC ...
H01L 51/0043 (2013.01); C08F 232/00 (2013.01); C08L 65/00 (2013.01); H01L 51/0035 (2013.01); C08L 2203/20 (2013.01); H01L 51/0529 (2013.01); H01L 51/0541 (2013.01); H01L 51/0545 (2013.01); Y10T 428/31938 (2015.04);
Abstract

Embodiments in accordance with the present invention provide for the use of polycycloolefins in electronic devices and more specifically to the use of such polycycloolefins as interlayers applied to fluoropolymer layers used in the fabrication of electronic devices, the electronic devices that encompass such polycycloolefin interlayers and processes for preparing such polycycloolefin interlayers and electronic devices.


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