The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 28, 2017
Filed:
Jul. 10, 2014
Lite-on Opto Technology (Changzhou) Co., Ltd., Jiangsu Province, CN;
Lite-on Technology Corp., Taipei, TW;
Yi-Fei Lee, Taipei, TW;
Tsan-Yu Ho, Taipei, TW;
Shih-Chang Hsu, Taipei, TW;
Chen-Hsiu Lin, Taipei, TW;
Lite-On Opto Technology (Changzhou) Co., Ltd., Jiangsu Province, CN;
Lite-On Technology Corp., Taipei, TW;
Abstract
An LED package includes a chip carrier, an adhesive layer, one high-voltage LED die, and an encapsulating member. The chip carrier defines a receiving space. The adhesive layer is disposed in the receiving space and has a thermal conductivity of larger than or equal to 1 W/mK. The high-voltage LED die is attached to the adhesive layer to be received in the reflective space and has a top surface formed with a trench. The trench of the high-voltage LED die is disposed at an optical center of the receiving space. The encapsulating member encapsulates the high-voltage LED die and includes a plurality of diffusers. The trench is embedded with the encapsulating member and has a width ranging from 1 μm to 10 μm and a depth of less than or equal to 50 μm.