The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 28, 2017
Filed:
May. 08, 2015
Applicant:
Shanghai Huali Microelectronics Corporation, Shanghai, CN;
Inventors:
Haifeng Zhou, Shanghai, CN;
Jun Tan, Shanghai, CN;
Assignee:
SHANGHAI HUALI MICROELECTRONICS CORPORATION, Shanghai, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/0328 (2006.01); H01L 31/0336 (2006.01); H01L 31/072 (2012.01); H01L 31/109 (2006.01); H01L 31/0256 (2006.01); H01L 29/78 (2006.01); H01L 29/161 (2006.01); H01L 29/165 (2006.01); H01L 29/08 (2006.01); H01L 29/66 (2006.01); H01L 21/02 (2006.01); H01L 21/306 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7848 (2013.01); H01L 21/02532 (2013.01); H01L 21/30604 (2013.01); H01L 29/0847 (2013.01); H01L 29/161 (2013.01); H01L 29/165 (2013.01); H01L 29/6656 (2013.01); H01L 29/66636 (2013.01);
Abstract
The present invention is directed to semiconductor processes and devices. More specifically, embodiments of the present invention provide a semiconductor device that comprises a diamond-shaped cavity, and the shaped cavity is filled with silicon and germanium material. There are other embodiments as well.