The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 28, 2017

Filed:

Dec. 23, 2014
Applicant:

Altera Corporation, San Jose, CA (US);

Inventors:

Chun Lee Ler, Tangkak, MY;

Hong Hai Teh, Sungai Bakap, MY;

Albert Victor Kordesch, Georgetown, MY;

Assignee:

Altera Corporation, San Jose, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/04 (2006.01); H01L 49/02 (2006.01); H01L 27/02 (2006.01);
U.S. Cl.
CPC ...
H01L 28/10 (2013.01); H01L 27/0207 (2013.01);
Abstract

An integrated circuit (IC) die may include a substrate layer and an inductor with an associated capacitance formed on one of multiple metal layers above the substrate layer. Power shielding strips may be formed between the inductor and the substrate layer. Portions of the power shielding strips may be selectively activated to adjust the capacitance of the inductor. As an example, switches may be coupled to the power shielding strips to selectively couple a portion of the power shielding strips to a ground voltage to increase the capacitance of the inductor. As another example, a fuse element may be used to selectively activate desired portions of the power shielding strips.


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