The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 28, 2017

Filed:

Jun. 16, 2014
Applicant:

Soitec, Crolles, FR;

Inventors:

Marcel Broekaart, Theys, FR;

Laurent Marinier, Lumbin, FR;

Assignee:

Soitec, Bernin, FR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 27/146 (2006.01); H01L 21/78 (2006.01); H01L 25/00 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14687 (2013.01); H01L 21/6835 (2013.01); H01L 21/78 (2013.01); H01L 25/50 (2013.01); H01L 27/1464 (2013.01); H01L 27/14636 (2013.01); H01L 2221/68363 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A process for transferring a buried circuit layer comprises taking a donor substrate comprising an internal etch stop zone and covered on its front side with a circuit layer, producing over the entire circumference of the donor substrate either a peripheral trench or a peripheral routing, the routing or trench being produced over a depth such that they pass entirely through the circuit layer and extend into the donor substrate, depositing on the circuit layer and on the routed side or on the walls of the trench a layer of an etch stop material that is selective with respect to etching of the circuit layer, without filling the trench, bonding a receiver substrate to the donor substrate, and thinning the donor substrate by etching its back side until reaching the etch stop zone so as to obtain the transfer of the buried circuit layer to the receiver substrate.


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