The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 28, 2017

Filed:

May. 27, 2014
Applicant:

Linxens Holding, Guyancourt, FR;

Inventors:

Severine Dieu-Gomont, Limetz-Villez, FR;

Bertrand Hoveman, Eragny-sur-Oise, FR;

Assignee:

Linxens Holding, Guyancourt, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/498 (2006.01); H05K 1/02 (2006.01); H05K 3/06 (2006.01); H05K 3/28 (2006.01); G06K 19/077 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H01L 24/85 (2013.01); H01L 23/49855 (2013.01); H01L 24/49 (2013.01); H05K 1/028 (2013.01); H05K 1/0296 (2013.01); H05K 1/115 (2013.01); H05K 3/06 (2013.01); H05K 3/28 (2013.01); G06K 19/07769 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48228 (2013.01); H01L 2224/49109 (2013.01); H01L 2224/85002 (2013.01); H01L 2924/00014 (2013.01); H05K 1/11 (2013.01); H05K 2201/0394 (2013.01); H05K 2201/095 (2013.01); H05K 2201/09509 (2013.01);
Abstract

The invention concerns a method for producing a printed circuit for a chip card module. This method involves producing two layers of electrically conductive material insulated from each other by a layer of insulating material, connection holes extending through the layer of insulating material and blocked by one of the layers of electrically conductive material, an area free of conductive material being provided in the other layer of electrically conductive material around the connection holes. The invention also concerns a printed circuit for a chip card produced using this method and a chip card module including such a printed circuit.


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