The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 28, 2017

Filed:

Sep. 09, 2013
Applicant:

Samsung Display Co., Ltd., Yongin, Gyeonggi-Do, KR;

Inventor:

Hyeong-Cheol Ahn, Suwon-si, KR;

Assignee:

Samsung Display Co., Ltd., Samsung-ro, Giheung-Gu, Yongin-si, Gyeonggi-Do, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H05K 1/02 (2006.01); H01L 23/498 (2006.01); G02F 1/1345 (2006.01); H05K 1/18 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); H01L 23/4985 (2013.01); H05K 1/0281 (2013.01); G02F 1/13452 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H05K 1/189 (2013.01); H05K 3/3452 (2013.01); H05K 2201/10128 (2013.01); H05K 2201/10681 (2013.01); H05K 2201/2009 (2013.01); H05K 2203/0577 (2013.01);
Abstract

A flexible chip on film includes a base insulating layer, a metal layer disposed on an upper surface of the base insulating layer and including a circuit pattern, an integrated circuit chip disposed on an upper surface of the metal layer and electrically connected to the metal layer, a solder resist layer disposed on the metal layer and insulated from the integrated circuit chip, and a reinforcing layer disposed on an upper surface of the solder resist layer. When the chip on film COF is bent, a neutral surface, in which a vector sum of a tensile force and a compressive force becomes substantially zero, is placed in the metal layer.


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