logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9583430 B1

PDFFull Text
Date of Patent:
Feb. 28, 2017

Filed:

Aug. 11, 2014

Package-on-package device

Applicants:

Kyol Park, Daejeon, KR;

Jichul Kim, Yongin-si, KR;

Yunhyeok Im, Hwaseong-si, KR;

Eon Soo Jang, Suwon-si, KR;

Inventors:

Kyol Park, Daejeon, KR;

Jichul Kim, Yongin-si, KR;

Yunhyeok Im, Hwaseong-si, KR;

Eon Soo Jang, Suwon-si, KR;

Assignee:

SAMSUNG ELECTRONICS CO., LTD., , KR;

Attorney:

Renaissance IP Law Group LLP

Primary Examiner:

Kimberly Rizkallah

Assistant Examiner:

Bo Bin Jang

Int. Cl.
CPC ...
H01L 23/538 (2006.01); H01L 23/522 (2006.01); H01L 23/552 (2006.01); H01L 25/10 (2006.01); H01L 25/00 (2006.01); H01L 23/31 (2006.01); H01L 23/36 (2006.01); H01L 23/498 (2006.01); H05K 1/02 (2006.01); H05K 1/14 (2006.01); H01L 25/065 (2006.01); H01L 23/42 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5226 (2013.01); H01L 23/3128 (2013.01); H01L 23/36 (2013.01); H01L 23/49811 (2013.01); H01L 23/49827 (2013.01); H01L 23/5385 (2013.01); H01L 23/552 (2013.01); H01L 25/105 (2013.01); H01L 25/50 (2013.01); H05K 1/0207 (2013.01); H05K 1/141 (2013.01); H01L 23/42 (2013.01); H01L 24/73 (2013.01); H01L 25/0657 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/92225 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06568 (2013.01); H01L 2225/107 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1058 (2013.01); H01L 2225/1094 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15331 (2013.01); H01L 2924/181 (2013.01); H05K 2201/10378 (2013.01);
Abstract

The inventive concepts provide package-on-package (PoP) devices. In the PoP devices, an interposer substrate and a thermal boundary material layer may be disposed between a lower semiconductor package and an upper semiconductor package to rapidly exhaust heat generated from a lower semiconductor chip included in the lower semiconductor package. The interposer substrate may be formed of one or more insulating layers, conductive vias, heat dissipating members, protection layers, and various conductive patterns.

Find Patent Forward Citations

Quick Actions:

Park, Kyol. (2017). Package-on-package device (U.S. Patent No. 9583430). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9583430

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…