The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 28, 2017
Filed:
Mar. 17, 2015
Infineon Technologies Austria Ag, Villach, AT;
Andrew Christopher Graeme Wood, St.Jakob i. Rosental, AT;
Gernot Fasching, Villach, AT;
Marius Aurel Bodea, Villach, AT;
Thomas Krotscheck Ostermann, Velden am Worthersee, AT;
Erwin Bacher, Villach, AT;
Infineon Technologies Austria AG, Villach, AT;
Abstract
A method for semiconductor fabrication includes forming a first array of semiconductor circuitry and a second array of semiconductor circuitry separated by a singulation region and a contact region. The method also includes forming a first array of process control monitoring structures within the singulation region of a substrate. The method also includes forming a first array of contact pads disposed in the contact region. The method also includes forming electrical connections between the first array of process control monitoring structures and the first array of contact pads, wherein all external electrical connections to the first array of process control monitoring structures are made through the first array of contact pads.