The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 28, 2017

Filed:

Dec. 17, 2013
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Inventors:

Jea-Eun Jess Shim, Hwaseong-si, KR;

Jin-Man Kim, Hwaseong-si, KR;

Hee-Sam Kim, Hwaseong-si, KR;

Jong-Bum Park, Suwon-si, KR;

Kwang-Bo Sim, Seongnam-si, KR;

Sang-Young Lee, Hwaseong-si, KR;

Assignee:

SAMSUNG ELECTRONICS CO., LTD., Suwon-si, Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23C 16/50 (2006.01); C23C 16/00 (2006.01); C23F 1/00 (2006.01); H01L 21/306 (2006.01); H01L 21/683 (2006.01); H01J 37/32 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6833 (2013.01); H01J 37/32009 (2013.01); H01J 37/3244 (2013.01); H01J 37/32091 (2013.01); H01J 37/32697 (2013.01); H01J 37/32724 (2013.01);
Abstract

An ESC may include a dielectric layer, an electrode, a pedestal, a heater, an adhesive and a protecting ring. The dielectric layer may be configured to support a substrate. The electrode may be disposed in the dielectric layer and is configured to form plasma over the substrate. The pedestal may be disposed under the dielectric layer. The heater may be disposed between the pedestal and the dielectric layer and is configured to heat the substrate. The adhesive may be disposed between the pedestal and the heater, and between the heater and the dielectric layer. The protecting ring may be configured to surround the adhesive. The protecting ring may include a plasma-resistant material.


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