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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9583368 B1

PDFFull Text
Date of Patent:
Feb. 28, 2017

Filed:

May. 05, 2016

Flip chip package and manufacturing method thereof

Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventor:

Seok Yoon Hong, Suwon-si, KR;

Assignee:

Samsung Electro-Mechanics Co., Ltd., Suwon-si, KR;

Attorney:

NSIP Law

Primary Examiner:

Michael Lebentritt

Int. Cl.
CPC ...
H01L 21/20 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01); H01L 23/50 (2006.01); H01L 21/60 (2006.01);
U.S. Cl.
CPC ...
H01L 21/563 (2013.01); H01L 21/4846 (2013.01); H01L 21/4853 (2013.01); H01L 23/3142 (2013.01); H01L 23/3185 (2013.01); H01L 23/49811 (2013.01); H01L 23/49838 (2013.01); H01L 24/17 (2013.01); H01L 24/81 (2013.01); H01L 23/49827 (2013.01); H01L 23/50 (2013.01); H01L 2021/60022 (2013.01); H01L 2224/11013 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16237 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/92125 (2013.01);
Abstract

A flip chip package and a manufacturing method thereof are disclosed. The flip chip package in accordance with an embodiment of the present invention includes: a substrate; a plurality of pads formed on the substrate; a solder resist covering the substrate in such a way that the pads are exposed; a chip mounted on the substrate in such a way that the chip is electrically connected with the pads; a plurality of bumps formed, respectively, on the pads in such a way that the bumps are interposed between the pads and the chip; an under-fill flowing between the substrate and the chip and being filled in between the substrate and the chip; and an opening placed in between the plurality of bumps in such a way that a flowing space of the under-fill is provided in between the plurality of bumps.

Find Patent Forward Citations

Hong, Seok. (2017). Flip chip package and manufacturing method thereof (U.S. Patent No. 9583368). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9583368

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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