The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 28, 2017

Filed:

Jul. 02, 2014
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-Si, Gyeonggi-Do, KR;

Inventor:

Bong Sup Lim, Suwon-Si, KR;

Assignee:

SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01F 5/00 (2006.01); H01F 27/28 (2006.01); H01F 27/29 (2006.01); H01F 17/00 (2006.01);
U.S. Cl.
CPC ...
H01F 27/292 (2013.01); H01F 17/0013 (2013.01);
Abstract

A multilayer electronic component includes a ceramic body including a plurality of insulating layers; an internal coil part in which a plurality of first internal coil patterns and a plurality of second internal coil patterns disposed on the insulating layers are connected to each other; and a first external electrode connected to first lead parts of the first and second internal coil patterns, and a second external electrode connected to second lead parts of the first and second internal coil patterns, wherein the first and second internal coil patterns are disposed on the insulating layers adjacent to each other and are connected to each other in parallel, and the via electrodes are disposed such that a plurality of via electrodes configure a single connection terminal.


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