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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9583251 B1

PDFFull Text
Date of Patent:
Feb. 28, 2017

Filed:

Apr. 14, 2015

Chip electronic component and board having the same

Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Inventors:

Je Ik Moon, Suwon-si, KR;

Sung Soo Kim, Suwon-si, KR;

Tae Young Kim, Suwon-si, KR;

Ye Eun Jeong, Suwon-si, KR;

Jong Hun Kim, Suwon-si, KR;

Seong Min Chin, Suwon-si, KR;

Assignee:

SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, Gyeonggi-do, KR;

Attorney:

McDermott Will & Emery LLP

Primary Examiner:

Mangtin Lian

Int. Cl.
CPC ...
H01F 5/00 (2006.01); H01F 27/24 (2006.01); H01F 27/29 (2006.01); H01F 27/255 (2006.01); H01F 27/28 (2006.01); H01F 17/00 (2006.01); H01F 17/04 (2006.01);
U.S. Cl.
CPC ...
H01F 27/255 (2013.01); H01F 17/0013 (2013.01); H01F 27/2804 (2013.01); H01F 27/292 (2013.01); H01F 2017/048 (2013.01); H01F 2027/2809 (2013.01);
Abstract

There is provided a chip electronic component including: a magnetic body containing magnetic metal powder particles and a thermosetting resin; an internal coil part embedded in the magnetic body; and a surface protection layer with which a surface of the magnetic body is coated. The surface protection layer may prevent a plating spreading phenomenon occurring on a surface of the chip electronic component at the time of forming external electrodes.

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