The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 28, 2017

Filed:

May. 18, 2014
Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventors:

Hee Jun Park, San Diego, CA (US);

Young Hoon Kang, San Diego, CA (US);

Ronald Frank Alton, Oceanside, CA (US);

Christoper Lee Medrano, Longmont, CO (US);

Jon James Anderson, Boulder, CO (US);

Assignee:

QUALCOMM INCORPORATED, San Diego, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 1/32 (2006.01); G05D 23/19 (2006.01); G05B 15/02 (2006.01); G06F 1/20 (2006.01); G06F 1/26 (2006.01);
U.S. Cl.
CPC ...
G05D 23/1917 (2013.01); G05B 15/02 (2013.01); G06F 1/203 (2013.01); G06F 1/206 (2013.01); G06F 1/26 (2013.01); G06F 1/324 (2013.01); G06F 1/3206 (2013.01); G06F 1/3296 (2013.01); Y02B 60/1275 (2013.01);
Abstract

Various embodiments of methods and systems for energy efficiency aware thermal management in a portable computing device that contains a heterogeneous, multi-processor system on a chip ('SoC') are disclosed. Because individual processing components in a heterogeneous, multi-processor SoC may exhibit different processing efficiencies at a given temperature, energy efficiency aware thermal management techniques that compare performance data of the individual processing components at their measured operating temperatures can be leveraged to optimize quality of service ('QoS') by adjusting the power supplies to, reallocating workloads away from, or transitioning the power mode of, the least energy efficient processing components. In these ways, embodiments of the solution optimize the average amount of power consumed across the SoC to process a MIPS of workload.


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