The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 28, 2017
Filed:
Jan. 20, 2015
Applicant:
Samsung Electronics Co., Ltd., Suwon-Si, Gyeonggi-Do, KR;
Inventors:
Byoung-Hoon Lee, Suwon-si, KR;
June-Hee Lee, Hwaseong-si, KR;
Geun-Woo Kim, Seoul, KR;
Min-Woo Song, Seongnam-si, KR;
Seok-Jun Won, Seoul, KR;
Assignee:
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/26 (2014.01); H01L 21/66 (2006.01); C23C 16/44 (2006.01); C23C 16/32 (2006.01); C23C 16/34 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
C23C 16/4404 (2013.01); C23C 16/32 (2013.01); C23C 16/34 (2013.01); H01L 21/67005 (2013.01); G01B 2210/56 (2013.01);
Abstract
A method for operating semiconductor manufacturing equipment is provided. The method includes forming a conductive thin film on an inner side surface of a reaction chamber and on a substrate in the reaction chamber, the conductive thin film including a first conductive material, and forming a particle preventive layer on the inner side surface of the reaction chamber in which the conductive thin film is formed.