The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 28, 2017
Filed:
Oct. 31, 2012
Jx Nippon Mining & Metals Corporation, Tokyo, JP;
JX Nippon Mining & Metals Corporation, Tokyo, JP;
Abstract
There are provided an electronic component metal material which has low insertability/extractability, low whisker formability, and high durability, and a method for manufacturing the metal material. The electronic component metal materialincludes a base material, an A layerconstituting an outermost surface layer on the base materialand formed of Sn, In or an alloy thereof, and a B layerconstituting a middle layer provided between the base materialand the A layerand formed of Ag, Au, Pt, Pd, Ru, Rh, Os, Ir or an alloy thereof, wherein the outermost surface layer (A layer)has a thickness of 0.002 to 0.2 μm, and the middle layer (B layer)has a thickness larger than 0.3 μm.