The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9580783 B1

PDF
Full Text
Expired
Date of Patent:
Feb. 28, 2017

Filed:

Oct. 31, 2012
Applicant:

Jx Nippon Mining & Metals Corporation, Tokyo, JP;

Inventors:

Yoshitaka Shibuya, Ibaraki, JP;

Kazuhiko Fukamachi, Ibaraki, JP;

Atsushi Kodama, Ibaraki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/00 (2006.01); C22F 1/00 (2006.01); C25D 5/10 (2006.01); C25D 5/12 (2006.01); C25D 5/50 (2006.01); C25D 3/04 (2006.01); C25D 3/12 (2006.01); C25D 3/20 (2006.01); C25D 3/38 (2006.01); C25D 3/46 (2006.01); C25D 3/48 (2006.01); C25D 3/50 (2006.01);
U.S. Cl.
CPC ...
C22F 1/00 (2013.01); C25D 5/10 (2013.01); C25D 5/12 (2013.01); C25D 5/505 (2013.01); C25D 3/04 (2013.01); C25D 3/12 (2013.01); C25D 3/20 (2013.01); C25D 3/38 (2013.01); C25D 3/46 (2013.01); C25D 3/48 (2013.01); C25D 3/50 (2013.01);
Abstract

There are provided an electronic component metal material which has low insertability/extractability, low whisker formability, and high durability, and a method for manufacturing the metal material. The electronic component metal materialincludes a base material, an A layerconstituting an outermost surface layer on the base materialand formed of Sn, In or an alloy thereof, and a B layerconstituting a middle layer provided between the base materialand the A layerand formed of Ag, Au, Pt, Pd, Ru, Rh, Os, Ir or an alloy thereof, wherein the outermost surface layer (A layer)has a thickness of 0.002 to 0.2 μm, and the middle layer (B layer)has a thickness larger than 0.3 μm.


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Shibuya, Yoshitaka. (2017). Electronic component metal material and method for manufacturing the same (U.S. Patent No. 9580783). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9580783

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