The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 28, 2017

Filed:

Oct. 16, 2012
Applicants:

Thomas Kevin Mackinnon, Daniel Island, SC (US);

David Nelson, Ontario, CA;

Nolan Loy Son, Ontario, CA;

Trevor Reeve, Ontario, CA;

Inventors:

Thomas Kevin MacKinnon, Daniel Island, SC (US);

David Nelson, Ontario, CA;

Nolan Loy Son, Ontario, CA;

Trevor Reeve, Ontario, CA;

Assignee:

CertainTeed Corporation, Malvern, PA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 43/04 (2006.01); B29C 43/18 (2006.01); B29C 43/34 (2006.01); B29C 43/00 (2006.01); B29K 703/08 (2006.01); B29L 31/10 (2006.01);
U.S. Cl.
CPC ...
B29C 43/18 (2013.01); B29C 43/34 (2013.01); B29C 43/00 (2013.01); B29C 2043/3416 (2013.01); B29C 2043/3433 (2013.01); B29K 2703/08 (2013.01); B29L 2031/104 (2013.01); Y10T 442/3878 (2015.04);
Abstract

A method of shortening cycle time required to compression mold shingle or tile is provided, wherein carrier plates are comprised of a surface material and a base, and receive a thermoplastic material, thereon. The roofing material is applied to the carrier plate and the carrier plate is subjected to induction heating, by which its surface material has its temperature raised, without substantially raising the temperature of the carrier plate base, such that the thermoplastic material applied thereto is kept heated in the compression mold. Cooling of the thermoplastic material is by heat transfer from the carrier plate surface material to the carrier plate base, and with both materials having good heat conduction capability. The carrier plate surface material has a high receptivity to being heated by induction heating relative the carrier plate base. The carrier plates are serially delivered through the process, to the compression mold.


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