The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 28, 2017
Filed:
Aug. 30, 2013
Applicant:
Thoratec Corporation, Pleasanton, CA (US);
Inventors:
Mark McChrystal, San Ramon, CA (US);
Joseph C. Stark, III, San Leandro, CA (US);
Assignee:
THORATEC CORPORATION, Pleasanton, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01B 7/14 (2006.01); G01B 7/30 (2006.01); G01R 33/06 (2006.01); H01L 43/06 (2006.01); A61M 1/12 (2006.01); G01B 7/00 (2006.01); H05K 1/02 (2006.01); H05K 3/30 (2006.01); A61M 1/10 (2006.01); F04D 13/06 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); F04D 15/00 (2006.01); G01R 33/02 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
A61M 1/12 (2013.01); A61M 1/1086 (2013.01); A61M 1/122 (2014.02); F04D 13/064 (2013.01); F04D 15/0077 (2013.01); G01B 7/003 (2013.01); G01B 7/30 (2013.01); H05K 1/028 (2013.01); H05K 1/119 (2013.01); H05K 1/189 (2013.01); H05K 3/30 (2013.01); A61M 1/1031 (2014.02); H05K 3/4691 (2013.01); H05K 2201/052 (2013.01); H05K 2201/10151 (2013.01); Y10T 29/49009 (2015.01); Y10T 29/49128 (2015.01);
Abstract
Techniques for mounting a sensor are disclosed. In some implementations, a molded interconnect device carries a sensor for transducing a position of a rotor of the implantable blood pump. The molded interconnect device includes one or more integrated electronic circuit traces configured to electrically connect the Hall sensor with a printed circuit board of the implantable blood pump, and the molded interconnect device is configured to be mounted to the printed circuit board.