The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 21, 2017

Filed:

Feb. 22, 2011
Applicants:

Darin Bradley Ritter, Indianapolis, IN (US);

Mickey Jay Hunt, Camby, IN (US);

Mark William Gysin, Noblesville, IN (US);

Inventors:

Darin Bradley Ritter, Indianapolis, IN (US);

Mickey Jay Hunt, Camby, IN (US);

Mark William Gysin, Noblesville, IN (US);

Assignee:

Thomson Licensing, Issy les Moulineaux, unknown;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 5/00 (2006.01); H05K 7/00 (2006.01); H05K 7/20 (2006.01); H05K 13/00 (2006.01); G06F 1/16 (2006.01); H01L 23/40 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20445 (2013.01); H01L 23/4006 (2013.01); G06F 1/1656 (2013.01); H01L 2924/0002 (2013.01); H05K 7/20436 (2013.01); H05K 13/00 (2013.01);
Abstract

A passive cooling arrangement for an electronic housing assembly is provided. The assembly includes a frame disposed in the housing assembly; a circuit board supported in the frame; a heat generating component disposed on the circuit board; and a heat sink configured with a substantially flat peripheral portion and a depression portion. The substantially flat peripheral portion faces and is nearly coextensive with an outer wall of said housing assembly, and the depression portion is in thermal engagement with the heat generating component on the circuit board. The frame includes a base having embosses which support the circuit board in a position enabling thermal engagement of the heat generating component and the depression portion of the heat sink. The outer wall of the housing assembly is preferably unvented and the housing assembly is preferably oriented in use with the outer wall facing upwardly.


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