The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 21, 2017

Filed:

Oct. 16, 2015
Applicant:

Chaun-choung Technology Corp., New Taipei, TW;

Inventors:

Po-Chou Shih, New Taipei, TW;

Heng-Chi Hsu, New Taipei, TW;

Tun-Ta Chen, New Taipei, TW;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/367 (2006.01); H01L 23/427 (2006.01); H05K 7/20 (2006.01); H01L 23/473 (2006.01); H01L 23/467 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20309 (2013.01); H01L 23/367 (2013.01); H01L 23/3677 (2013.01); H01L 23/427 (2013.01); H01L 23/467 (2013.01); H01L 23/473 (2013.01); H05K 7/20318 (2013.01);
Abstract

A heat dissipating device used for a PCB having a heat generating component includes a vapor chamber, a fin set, and a fixture. The vapor chamber is attached to the heat generating component. The fin set is connected above to the vapor chamber. The fixture is fixed to the PCB. The vapor chamber and the fin set are clamped between the fixture and the PCB. The fixture has a press plate which is pressed against a top of the fin set. Therefore, the press plate presses the vapor chamber without direct contact. That is, the applied pressure is concentrated on the fin set and then distributed evenly to the vapor chamber, which prevents deformation of the vapor chamber due to uneven pressure and further achieves the effect of the vapor chamber being attached smoothly to the heat generating component.


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