The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 21, 2017
Filed:
Jan. 30, 2015
Applicant:
Labinal, Llc, Denton, TX (US);
Inventors:
Patrick Wellington Mills, Bradenton, FL (US);
James Michael McCormick, Bradenton, FL (US);
David Michael Geier, Punta Gorda, FL (US);
Assignee:
LABINAL, LLC, Denton, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 5/00 (2006.01); G06F 1/16 (2006.01); H05K 7/20 (2006.01); F28F 7/00 (2006.01); H05K 7/02 (2006.01); H02B 1/056 (2006.01); H05K 1/18 (2006.01); H05K 3/12 (2006.01); H05K 3/32 (2006.01);
U.S. Cl.
CPC ...
H05K 7/02 (2013.01); H05K 3/1258 (2013.01); H02B 1/056 (2013.01); H05K 1/182 (2013.01); H05K 3/1241 (2013.01); H05K 3/321 (2013.01); H05K 2201/10189 (2013.01); H05K 2201/10303 (2013.01); H05K 2203/0126 (2013.01);
Abstract
A method of manufacturing a backplane module includes providing a thermally conductive substrate, and applying a predetermined volume of epoxy extending between a first electrical component disposed on the thermally conductive substrate and a second electrical component disposed on the thermally conductive substrate to create an electrical pathway therebetween.