The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 21, 2017
Filed:
May. 26, 2015
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Inventors:
Hyojae Bang, Hwasung-si, KR;
Dogeun Kim, Seoul, KR;
Hongkyun Kim, Sungnam-si, KR;
Youngbok Jeon, Seoul, KR;
Assignee:
SAMSUNG ELECTRONICS CO., LTD., Gyeonggi-Do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/14 (2006.01); H05K 5/00 (2006.01); G06K 7/00 (2006.01); H01R 12/57 (2011.01); H01R 12/50 (2011.01); H05K 1/11 (2006.01); H01R 13/00 (2006.01); H05K 3/10 (2006.01); H05K 3/30 (2006.01); H05K 7/02 (2006.01); H05K 13/00 (2006.01); G06F 1/18 (2006.01); H05K 1/18 (2006.01); H01R 27/00 (2006.01); H05K 1/02 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 5/0026 (2013.01); G06F 1/18 (2013.01); G06F 1/185 (2013.01); G06K 7/0047 (2013.01); H01R 12/57 (2013.01); H01R 13/00 (2013.01); H01R 23/70 (2013.01); H05K 1/11 (2013.01); H05K 1/117 (2013.01); H05K 1/181 (2013.01); H05K 3/10 (2013.01); H05K 3/303 (2013.01); H05K 7/02 (2013.01); H05K 13/00 (2013.01); H01R 27/00 (2013.01); H05K 1/0295 (2013.01); H05K 3/3405 (2013.01); H05K 2201/09409 (2013.01); H05K 2201/09709 (2013.01); H05K 2201/09954 (2013.01); H05K 2201/10159 (2013.01); H05K 2201/10189 (2013.01); H05K 2201/10446 (2013.01); Y10S 439/946 (2013.01); Y10S 439/951 (2013.01); Y10T 29/49124 (2015.01); Y10T 29/49147 (2015.01);
Abstract
Example embodiments are directed to circuit boards, connectors, cases, circuit board assemblies, case assemblies, devices and methods of manufacturing the same, which are common to at least two different form factors. In an example embodiment, the SSD includes a circuit board that is smaller than a case, and the circuit board is secured to the bottom surface of the case by the securing element. The securing element is spaced apart from edges of the case to allow using a circuit board that is smaller than the case.