The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 21, 2017
Filed:
Feb. 05, 2015
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventors:
Mariko Ono, Fukuoka, JP;
Akira Goto, Fukuoka, JP;
Rei Yoneyama, Tokyo, JP;
Takami Otsuki, Tokyo, JP;
Assignee:
Mitsubishi Electric Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H05K 3/44 (2006.01); H01L 23/043 (2006.01); H05K 3/38 (2006.01); H01L 23/495 (2006.01); H01L 23/31 (2006.01); H01L 23/29 (2006.01); H01L 23/00 (2006.01); H01L 21/48 (2006.01); H05K 1/05 (2006.01); H05K 1/09 (2006.01); H05K 1/03 (2006.01); H01L 23/14 (2006.01); H01L 23/373 (2006.01); H01L 23/48 (2006.01); H01L 23/053 (2006.01); H01L 23/24 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H05K 3/44 (2013.01); H01L 21/4828 (2013.01); H01L 21/4842 (2013.01); H01L 23/043 (2013.01); H01L 23/053 (2013.01); H01L 23/14 (2013.01); H01L 23/24 (2013.01); H01L 23/296 (2013.01); H01L 23/3107 (2013.01); H01L 23/3735 (2013.01); H01L 23/48 (2013.01); H01L 23/49534 (2013.01); H01L 23/49541 (2013.01); H01L 23/49582 (2013.01); H01L 23/49586 (2013.01); H01L 24/40 (2013.01); H01L 24/49 (2013.01); H05K 1/0326 (2013.01); H05K 1/056 (2013.01); H05K 1/09 (2013.01); H05K 3/38 (2013.01); H01L 23/3736 (2013.01); H01L 23/49861 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 2224/291 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/40095 (2013.01); H01L 2224/40225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48177 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/0665 (2013.01); H01L 2924/1033 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/10272 (2013.01); H01L 2924/17724 (2013.01); H01L 2924/17747 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19107 (2013.01); H05K 3/381 (2013.01); H05K 3/383 (2013.01); H05K 2201/066 (2013.01); H05K 2203/06 (2013.01);
Abstract
A metal base substrate of the present invention includes a copper plate made of copper, a metal layer that is formed on the copper plate and is made of a metal different from the copper, an insulating resin sheet that is formed by bonding a sheet made of an insulating resin onto the metal layer, and a circuit pattern formed on the insulating resin sheet.