The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 21, 2017
Filed:
May. 17, 2012
Akimitsu Bamba, Fukui, JP;
Kazuhisa Tsujimoto, Fukui, JP;
Hideyuki Yamada, Fukui, JP;
Kouichi Kugimiya, Fukui, JP;
Akimitsu Bamba, Fukui, JP;
Kazuhisa Tsujimoto, Fukui, JP;
Hideyuki Yamada, Fukui, JP;
Kouichi Kugimiya, Fukui, JP;
SEIREN CO., LTD., Fukui, JP;
Abstract
The purpose of the present invention is to provide a method for using a metal ion solution of low concentration to efficiently form a metal film pattern of excellent accuracy and reliable adhesion on a resin substrate. A resin substrate having a metal film pattern formed thereon is produced by a method that includes the following steps (a) to (e): (a) a step for pattern-printing of a latent image agent () onto the surface of a resin substrate () ; (b) a step for bringing the area imprinted with the latent image agent () into contact with a solution containing metal ions, and forming a metal salt (); (c) a step for bringing the metal salt () into contact with an acidic treatment liquid containing a reducing agent, and reducing the metal salt; (d) a step for forming an electroless nickel plating film () on the area imprinted with the latent image agent; and (e) a step for precipitating an electroless copper plating () onto the surface of the nickel plating film ().