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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9578734 B1

PDFFull Text
Date of Patent:
Feb. 21, 2017

Filed:

Sep. 19, 2013

Prepreg, metal-clad laminate, and printed wiring board

Applicant:

Panasonic Corporation, Osaka, JP;

Inventors:

Hiroharu Inoue, Osaka, JP;

Koji Kishino, Fukushima, JP;

Assignee:

PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD., Osaka, JP;

Attorney:

McDermott Will & Emery LLP

Primary Examiner:

Jeremy R Pierce

Int. Cl.
CPC ...
H05K 1/02 (2006.01); C08J 5/24 (2006.01); B32B 15/14 (2006.01); H05K 1/03 (2006.01); C08G 59/62 (2006.01); C08L 63/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0271 (2013.01); B32B 15/14 (2013.01); C08G 59/621 (2013.01); C08J 5/24 (2013.01); C08L 63/00 (2013.01); H05K 1/038 (2013.01); C08J 2333/02 (2013.01); C08J 2363/00 (2013.01); C08J 2433/02 (2013.01); C08L 2205/02 (2013.01); Y10T 428/249921 (2015.04); Y10T 442/20 (2015.04);
Abstract

The present disclosure relates to a prepreg formed by drying a fabric substrate impregnated with a resin composition by means of heating until the resin composition is in a semi-cured state. The resin composition contains (A) at least one of an epoxy resin having naphthalene skeleton and a phenolic curing agent; and (B) a polymer having structures represented by the following formulae (I) and (II), no unsaturated bond between carbon atoms, an epoxy value ranging from 0.2 to 0.8 ep/kg, and an weight-average molecular weight ranging from 200,000 to 850,000: wherein X:Y=0:1 to 0.35:0.65, Rrepresents H or CH, and Rrepresents H or an alkyl group.

Find Patent Forward Citations

Inoue, Hiroharu. (2017). Prepreg, metal-clad laminate, and printed wiring board (U.S. Patent No. 9578734). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9578734

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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