The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 21, 2017

Filed:

Dec. 05, 2014
Applicant:

Sumitomo Electric Industries, Ltd., Osaka, JP;

Inventor:

Hirotaka Oomori, Yokohama, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 3/04 (2006.01); H01S 5/00 (2006.01); H04B 10/40 (2013.01); H04B 10/50 (2013.01); H01S 3/067 (2006.01); H01S 5/022 (2006.01); H01S 5/06 (2006.01); H01S 5/026 (2006.01);
U.S. Cl.
CPC ...
H04B 10/40 (2013.01); H01S 3/0405 (2013.01); H01S 3/06704 (2013.01); H01S 5/02276 (2013.01); H04B 10/50 (2013.01); H04B 10/503 (2013.01); H04B 10/506 (2013.01); H01S 5/0261 (2013.01); H01S 5/0617 (2013.01);
Abstract

An optical transmitting unit comprises an integrated optical transmitter module including an LD, a TEC configured to heat or cool the LD, a thermal sensor configured to sense a temperature of the LD, and a package configured to house the LD, the thermal sensor, and the TEC, an MCU, and a temperature detection circuit configured to detect a temperature outside the package. The thermal sensor is thermally coupled with the TEC and is also thermally coupled with the outside of the package, and the MCU defines data output from the temperature detection circuit as an internal temperature when the LD is being energized, and estimates the data of internal temperature on the basis of the temperature detected with the thermal sensor and the data when the LD is not being energized.


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