The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 21, 2017

Filed:

May. 10, 2016
Applicant:

Seiko Epson Corporation, Tokyo, JP;

Inventors:

Yuichi Takebayashi, Sagamihara, JP;

Koji Hosaka, Minamiminowa, JP;

Yoshiyuki Yamaguchi, Minowa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 41/053 (2006.01); H01L 41/083 (2006.01); H01L 41/297 (2013.01); H03B 5/32 (2006.01); H03H 9/10 (2006.01); H03H 9/13 (2006.01); H03H 9/19 (2006.01); H03H 9/05 (2006.01);
U.S. Cl.
CPC ...
H03H 9/19 (2013.01); H01L 41/053 (2013.01); H01L 41/083 (2013.01); H01L 41/297 (2013.01); H03B 5/32 (2013.01); H03H 9/0542 (2013.01); H03H 9/10 (2013.01); H03H 9/131 (2013.01);
Abstract

An electronic component includes: an oscillation circuit that is electrically connected to a resonator element; and a substrate that includes a first surface on which the oscillation circuit and wiring that is electrically connected with the resonator element and the oscillation circuit to form an oscillation loop are disposed, and a second surface opposite to the first surface. The substrate includes a conductor layer between the first surface and the second surface. The conductor layer overlaps the wiring in a plan view. A distance between the wiring and the conductor layer in a thickness direction as a direction along a direction intersecting the first surface and the second surface is from 0.35 mm to 0.7 mm.


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