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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9577308 B1

PDFFull Text
Expired
Date of Patent:
Feb. 21, 2017

Filed:

Mar. 11, 2014

Interconnecting structure for electrically connecting a first electronic device with a second electronic device

Applicant:

National Chiao Tung University, Hscinchu, TW;

Inventors:

Chun-Hsing Li, Hsinchu, TW;

Chien-Nan Kuo, Hsinchu, TW;

Chun-Lin Ko, Hsinchu, TW;

Assignee:

NATIONAL CHAIO TUNG UNIVERSITY, , TW;

Attorney:

Volpe and Koenig, P.C.

Primary Examiner:

Benny Lee

Assistant Examiner:

Jorge Salazar, Jr

Int. Cl.
CPC ...
H01P 5/02 (2006.01); H01P 1/04 (2006.01); H01L 23/00 (2006.01); H01P 3/02 (2006.01); H01L 23/64 (2006.01);
U.S. Cl.
CPC ...
H01P 5/02 (2013.01); H01L 24/49 (2013.01); H01P 1/04 (2013.01); H01L 23/64 (2013.01); H01L 2224/49175 (2013.01); H01L 2924/00014 (2013.01); H01P 3/026 (2013.01); H01P 5/028 (2013.01); Y10T 29/49002 (2015.01);
Abstract

An interconnecting structure for electrically connecting a first electronic device with a second electronic device is provided. The first electronic device has two first bond-pads, and the second electronic device has two second bond-pads electrically connected to the two first bond-pads respectively. The interconnecting structure includes a signal transmission structure electrically connected to the two first bond-pads and the two second bond-pads; and a ground device disposed between the first electronic device and the second electronic device so that the first electronic device and the second electronic device have a same ground potential.

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Li, Chun-Hsing. (2017). Interconnecting structure for electrically connecting a first electronic device with a second electronic device (U.S. Patent No. 9577308). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9577308

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