The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 21, 2017

Filed:

Aug. 26, 2015
Applicant:

Advanced Optoelectronic Technology, Inc., Hsinchu Hsien, TW;

Inventors:

Ching-Hsueh Chiu, Hsinchu, TW;

Ya-Wen Lin, Hsinchu, TW;

Po-Min Tu, Hsinchu, TW;

Shih-Cheng Huang, Hsinchu, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/54 (2010.01); H01L 33/56 (2010.01); H01L 25/075 (2006.01); H01L 33/50 (2010.01); H01L 33/62 (2010.01); H01L 33/52 (2010.01); H01L 33/58 (2010.01);
U.S. Cl.
CPC ...
H01L 33/54 (2013.01); H01L 25/0753 (2013.01); H01L 33/507 (2013.01); H01L 33/52 (2013.01); H01L 33/56 (2013.01); H01L 33/58 (2013.01); H01L 33/62 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0066 (2013.01);
Abstract

The present disclosure provides a light emitting diode package including a substrate, a first electrode and a second electrode located on a first surface of the substrate, a plurality of light emitting diodes (LEDs) located between the first electrode and the second electrode, a plurality of retaining ring located on the first surface of the substrate. The LEDs are surrounded by the retaining ring therein. An encapsulation layer is mounted in the retaining ring and covers the LEDs therein. The encapsulation layer includes a first surface and an side surface extending from edges of the first surface. The side of the encapsulation layer contacts an inner surface of the retaining ring. The present disclosre also provides a method for manufacturing the above light emitting diode package.


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