The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 21, 2017
Filed:
May. 12, 2015
Applicants:
Ashok Sinha, Los Altos Hill, CA (US);
Roman Milter, Alviso, CA (US);
Robert Broesler, San Francisco, CA (US);
Inventors:
Ashok Sinha, Los Altos Hill, CA (US);
Roman Milter, Alviso, CA (US);
Robert Broesler, San Francisco, CA (US);
Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 31/18 (2006.01); H01L 31/0224 (2006.01); H01L 31/0747 (2012.01); H01L 31/0236 (2006.01);
U.S. Cl.
CPC ...
H01L 31/1884 (2013.01); H01L 31/02366 (2013.01); H01L 31/022433 (2013.01); H01L 31/022466 (2013.01); H01L 31/0747 (2013.01); H01L 31/1804 (2013.01); H01L 31/186 (2013.01); Y02E 10/50 (2013.01);
Abstract
Methods for fabricating busbar and finger metallization over TCO are disclosed. Rather than using expensive and relatively resistive silver paste, a high conductivity and relatively low cost copper is used. Methods for enabling the use of copper as busbar and fingers over a TCO are disclosed, providing good adhesion while preventing migration of the copper into the TCO. Also, provisions are made for easy soldering contacts to the copper busbars.