The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 21, 2017

Filed:

Jan. 19, 2016
Applicants:

David D. Smith, Campbell, CA (US);

Timothy Weidman, Sunnyvale, CA (US);

Staffan Westerberg, Sunnyvale, CA (US);

Inventors:

David D. Smith, Campbell, CA (US);

Timothy Weidman, Sunnyvale, CA (US);

Staffan Westerberg, Sunnyvale, CA (US);

Assignee:

SunPower Corporation, San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/0368 (2006.01); H01L 31/18 (2006.01); H01L 31/0224 (2006.01); H01L 31/0236 (2006.01); H01L 31/0288 (2006.01); H01L 31/0745 (2012.01); H01L 31/0747 (2012.01);
U.S. Cl.
CPC ...
H01L 31/03685 (2013.01); H01L 31/0288 (2013.01); H01L 31/02363 (2013.01); H01L 31/02366 (2013.01); H01L 31/022441 (2013.01); H01L 31/022458 (2013.01); H01L 31/0745 (2013.01); H01L 31/0747 (2013.01); H01L 31/1804 (2013.01); H01L 31/1824 (2013.01); H01L 31/1864 (2013.01); H01L 31/1872 (2013.01); Y02E 10/50 (2013.01); Y02P 70/521 (2015.11);
Abstract

Methods of fabricating solar cell emitter regions using ion implantation, and resulting solar cells, are described. In an example, a back contact solar cell includes a crystalline silicon substrate having a light-receiving surface and a back surface. A first polycrystalline silicon emitter region is disposed above the crystalline silicon substrate. The first polycrystalline silicon emitter region is doped with dopant impurity species of a first conductivity type and further includes ancillary impurity species different from the dopant impurity species of the first conductivity type. A second polycrystalline silicon emitter region is disposed above the crystalline silicon substrate and is adjacent to but separated from the first polycrystalline silicon emitter region. The second polycrystalline silicon emitter region is doped with dopant impurity species of a second, opposite, conductivity type. First and second conductive contact structures are electrically connected to the first and second polycrystalline silicon emitter regions, respectively.


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