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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9577124 B1

PDFFull Text
Date of Patent:
Feb. 21, 2017

Filed:

Nov. 29, 2013

Infrared sensor and method for manufacturing same, filter member for infrared sensor, and photocoupler

Applicant:

Asahi Kasei Microdevices Corporation, Tokyo, JP;

Inventors:

Toshiaki Fukunaka, Tokyo, JP;

Yasutaka Myoraku, Tokyo, JP;

Assignee:

Asahi Kasei Microdevices Corporation, Tokyo, JP;

Attorney:

Morgan, Lewis & Bockius LLP

Primary Examiner:

David Porta

Assistant Examiner:

Meenakshi Sahu

Int. Cl.
CPC ...
G01J 5/00 (2006.01); H01L 31/0232 (2014.01); G01N 21/3504 (2014.01); H01L 31/173 (2006.01); G01J 1/02 (2006.01); G01J 1/04 (2006.01); G01N 21/35 (2014.01); G01N 21/61 (2006.01); H01L 31/02 (2006.01); H01L 31/12 (2006.01); G02B 5/20 (2006.01); H01L 31/09 (2006.01); H01L 31/16 (2006.01);
U.S. Cl.
CPC ...
H01L 31/02327 (2013.01); G01J 1/02 (2013.01); G01J 1/0271 (2013.01); G01J 1/04 (2013.01); G01J 1/0492 (2013.01); G01N 21/35 (2013.01); G01N 21/3504 (2013.01); G01N 21/61 (2013.01); G02B 5/208 (2013.01); H01L 31/02 (2013.01); H01L 31/0232 (2013.01); H01L 31/02325 (2013.01); H01L 31/09 (2013.01); H01L 31/12 (2013.01); H01L 31/16 (2013.01); H01L 31/173 (2013.01);
Abstract

A filter member includes a first lead terminal, an optical filter, and a first mold member, and a light incidence surface and a light emission surface of the optical filter is exposed from the first mold member. A sensor member includes an IR sensor element, a second lead terminal and a second mold member. A light-receiving surface of the IR sensor element is exposed from the second mole member. The filter member is disposed on the sensor member so that the light emission surface of the optical filter faces the light-receiving surface of the IR sensor element in the sensor member.

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