The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 21, 2017

Filed:

Jun. 21, 2016
Applicant:

Toyota Jidosha Kabushiki Kaisha, Toyota-shi, Aichi-ken, JP;

Inventors:

Hidehiro Nakagawa, Toyota, JP;

Hiroshi Hata, Toyota, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/73 (2006.01); H01L 29/739 (2006.01); H01L 29/10 (2006.01); H01L 29/16 (2006.01); H01L 29/49 (2006.01); H01L 29/51 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7397 (2013.01); H01L 29/1095 (2013.01); H01L 29/1608 (2013.01); H01L 29/4916 (2013.01); H01L 29/51 (2013.01);
Abstract

The semiconductor device includes: a plurality of interlayer insulation films, each interlayer insulation film covering a front surface of a corresponding one of the gate electrodes and protruding from the front surface of the semiconductor substrate; the first metal film covering the front surface of the semiconductor substrate and plurality of the interlayer insulation films; and the protective insulation film covering a part of the first metal film. In a cross-section traversing the plurality of trenches, the end of the protective insulation film is above one of the interlayer insulation films, and a width of the one of the interlayer insulation films that is below the end of the protective insulation film is wider than widths of other interlayer insulation films.


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