The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 21, 2017
Filed:
Jan. 22, 2013
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Jae Sup Lee, Yongin-si, KR;
Seong Joong Kim, Suwon-si, KR;
Assignee:
Samsung Electronics Co., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/08 (2006.01); H01L 49/02 (2006.01); H01L 23/64 (2006.01); H01L 23/00 (2006.01); H01F 17/00 (2006.01); H01L 23/66 (2006.01); H01F 27/28 (2006.01);
U.S. Cl.
CPC ...
H01L 28/10 (2013.01); H01F 17/0006 (2013.01); H01L 23/645 (2013.01); H01L 23/66 (2013.01); H01L 24/06 (2013.01); H01L 24/49 (2013.01); H01F 2027/2814 (2013.01); H01L 2223/6611 (2013.01); H01L 2224/05553 (2013.01); H01L 2224/05554 (2013.01); H01L 2224/451 (2013.01); H01L 2224/4813 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/4903 (2013.01); H01L 2224/49113 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/3011 (2013.01); H01L 2924/3025 (2013.01); H01L 2924/30107 (2013.01); H01L 2924/30111 (2013.01);
Abstract
An inductor is provided. The inductor includes first and second bonding pads on a semiconductor substrate, a lead pin on a board trace, a first bonding wire being configured to connect the first bonding pad and the lead pin, and a second bonding wire configured to connect the second bonding pad and the lead pin, the second bonding wire being connected to the first bonding wire in parallel.