The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 21, 2017

Filed:

Jul. 25, 2014
Applicant:

Semiconductor Energy Laboratory Co., Ltd., Atsugi-shi, Kanagawa-ken, JP;

Inventors:

Masayuki Sakakura, Kanagawa, JP;

Hideto Ohnuma, Kanagawa, JP;

Hideaki Kuwabara, Kanagawa, JP;

Assignee:

Semiconductor Energy Laboratory Co., Ltd., Atsugi-shi, Kanagawa-ken, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G02F 1/136 (2006.01); H01L 29/04 (2006.01); H01L 27/12 (2006.01); H01L 21/768 (2006.01); H01L 23/528 (2006.01); H01L 27/32 (2006.01);
U.S. Cl.
CPC ...
H01L 27/1244 (2013.01); H01L 21/76816 (2013.01); H01L 21/76879 (2013.01); H01L 23/528 (2013.01); H01L 27/124 (2013.01); H01L 27/1214 (2013.01); H01L 27/1259 (2013.01); H01L 27/1288 (2013.01); H01L 27/3276 (2013.01); H01L 2924/0002 (2013.01);
Abstract

It is an object of the present invention to provide a method for preventing a breaking and poor contact, without increasing the number of steps, thereby forming an integrated circuit with high driving performance and reliability. The present invention applies a photo mask or a reticle each of which is provided with a diffraction grating pattern or with an auxiliary pattern formed of a semi-translucent film having a light intensity reducing function to a photolithography step for forming wires in an overlapping portion of wires. And a conductive film to serve as a lower wire of a two-layer structure is formed, and then, a resist pattern is formed so that a first layer of the lower wire and a second layer narrower than the first layer are formed for relieving a steep step.


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