The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 21, 2017
Filed:
Feb. 12, 2016
Applicant:
Kulicke and Soffa Industries, Inc., Fort Washington, PA (US);
Inventor:
Matthew B. Wasserman, Philadelphia, PA (US);
Assignee:
Kulicke and Soffa Industries, Inc., Fort Washington, PA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 37/00 (2006.01); H01L 23/00 (2006.01); B23K 3/00 (2006.01); B23K 3/02 (2006.01);
U.S. Cl.
CPC ...
H01L 24/75 (2013.01); B23K 3/00 (2013.01); B23K 3/027 (2013.01); H01L 24/81 (2013.01); H01L 2224/75252 (2013.01); H01L 2224/75301 (2013.01); H01L 2224/75502 (2013.01); H01L 2224/75981 (2013.01); H01L 2224/81203 (2013.01);
Abstract
A bond head assembly for bonding a semiconductor element to a substrate is provided. The bond head assembly includes a base structure, a heater, and a clamping system securing the heater to the base structure. The clamping system includes a plurality of elastic elements constraining the heater along a plurality of axes.